Revolutionizing Solder Mask Imaging with KLA YieldStar Direct Imaging Solutions

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Revolutionizing Solder Mask Imaging with KLA YieldStar Direct Imaging Solutions

Highly Accurate Direct Imaging for Solder Mask Applications

KLA's direct imaging (DI) solutions for solder mask (SM) go beyond traditional imaging techniques to offer high-accuracy, high-quality imaging with impressive production throughput capabilities. These cutting-edge solutions cater to a wide range of solder mask designs, from simple to highly complex configurations. Whether it's high-density interconnects (HDI), multi-layer boards (MLB), flexible printed circuit boards (FPCB), or specialized white solder mask applications like miniLED backlight units, KLA's solutions ensure consistently precise imaging quality at a low total cost of ownership.

Orbotech Diamond™ 10: Advancing Solder Mask Imaging

The Orbotech Diamond™ 10 DI system is a game-changer in the realm of solder mask imaging. Utilizing KLA's proprietary SolderFast™ technology, this advanced system is tailored for a diverse array of solder mask applications, setting new standards in quality and throughput. From high-density interconnect (HDI) boards to flexible printed circuit boards (FPCB), the Orbotech Diamond 10 system excels in delivering high-quality images for the most intricate designs. By enhancing imaging accuracy and reducing the total cost of ownership, Orbotech Diamond™ 10 elevates the solder mask imaging experience for mass production.

Orbotech Diamond™ 10W: Specialized Direct Imaging for White Solder Mask Applications

When it comes to white solder mask applications, particularly for products like miniLED backlight units, the Orbotech Diamond™ 10W DI system shines. Tailored specifically for white solder mask PCBs, this high-capacity imaging solution leverages KLA's SolderFast™ technology to provide exceptional imaging quality and throughput for mass production. By setting a higher standard for white solder mask applications, the Orbotech Diamond 10W system ensures superior imaging accuracy and quality while minimizing the total cost of ownership, making it the ideal choice for demanding production environments.

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Maximizing Chip Manufacturing Efficiency with KLA YieldStar Metrology Solutions

Archer™ Overlay Metrology Systems

KLA's Archer™ 750 overlay metrology system offers precise on-product overlay error feedback, crucial for achieving fast technology ramps and stable production of cutting-edge memory and logic devices. With wavelength tunability and 10nm resolution, this system ensures accurate overlay error measurements even in the presence of production process variations. The advanced algorithms and rAIM® overlay target design enhance the correlation between target and device overlay errors, enabling lithographers to accurately track device overlay performance.

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Revolutionizing Advanced Packaging with KLA YieldStar Wafer Processing Systems

KLA YieldStar Wafer Processing Systems Overview

KLA's YieldStar Wafer Processing Systems offer cutting-edge plasma etch and deposition process technologies tailored for advanced packaging schemes. From High-Density Fan-Out Wafer-Level Packaging (FOWLP) to intricate 3D packages featuring stacked die interconnected with through-silicon vias (TSV), KLA's solutions cater to a wide array of advanced packaging needs. These systems leverage KLA's extensive expertise in silicon etching, providing innovative plasma dicing solutions for dicing before or after grind processes on wafers up to 300mm in diameter. With a focus on precise process control and reliable production-proven methods, KLA enables chip manufacturers to reduce production costs while enhancing reliability, performance, and the integration of multiple functions.

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Empowering IoT Device Production with KLA YieldStar

Meeting the Demand for IoT Devices

In today's technological landscape, the Internet of Things (IoT) has propelled semiconductors to the forefront of every industry. The demand for low-cost devices with high-volume production capabilities and a variety of chip types, including those designed for 200mm and large design-rule nodes, has skyrocketed. To cater to this demand, fabs are upgrading and utilizing certified and remanufactured tools, originally introduced for cutting-edge design nodes. This surge in demand is fueled by the necessity for more mobile, automotive, and industrial IoT devices.

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Accelerating Reliability for Automotive Electronics with KLA YieldStar

Continuous Improvement Program for Automotive Fabs

Semiconductors and electronic components play a crucial role in driving innovation within the automotive industry. To ensure the reliability and quality of automotive electronics, KLA YieldStar offers a Continuous Improvement Program (CIP). This program leverages unpatterned wafer defect inspection to pinpoint the specific process tools responsible for defects. By implementing a tool monitoring CIP, automotive fabs can establish concrete targets for reducing process defects that impact reliability. This proactive approach allows manufacturers to enhance the overall quality of automotive electronics and drive continuous improvement.

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Enhancing Wafer Quality with KLA YieldStar Metrology Solution

Wafer Manufacturing Portfolio Overview

KLA's wafer manufacturing portfolio comprises defect inspection, review, metrology, and data management systems that play a crucial role in ensuring quality throughout the wafer fabrication process. These specialized tools not only assess wafer surface quality but also detect, count, and bin defects during production, thereby significantly contributing to outgoing wafer qualification. Moreover, wafer geometry systems ensure that the wafer shape remains extremely flat and uniform in thickness, with precise control over wafer shape topography. Additionally, data analysis and management systems proactively identify and address wafer/substrate fabrication process excursions that could potentially lead to yield loss.

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