Introduction to Deposition in Semiconductor Industry
Deposition plays a crucial role in the semiconductor industry by forming thin layers of materials on the wafer surface. These layers can be composed of various materials such as metals or dielectrics, shaping the electronic microstructure and altering surface characteristics of the devices on the wafer. KLA's YieldStar Deposition solutions offer advanced techniques to achieve precise and uniform thin-film deposition.
Physical Vapor Deposition (PVD) with KLA's SPTS Sigma® PVD
KLA's SPTS Sigma® PVD system utilizes physical vapor deposition (PVD) to produce coatings of conducting, semiconducting, or insulating materials on wafer surfaces. By employing sputtering technology, this system allows precise control over the deposition process. With support for wafer sizes ranging from 100mm to 300mm, the fxP cluster platform facilitates integration of various pre-treatment and deposition technologies to meet specific process requirements.
Plasma Enhanced Chemical Vapor Deposition (PECVD) with SPTS Delta™ and Osprey® PECVD Systems
KLA's SPTS Delta™ PECVD systems use plasma-enhanced chemical vapor deposition to produce thin films at low processing temperatures below 400°C. These systems are ideal for applications in RF, power, photonics, and MEMS industries that require low-temperature processing. The Delta™ fxP cluster system offers a wide range of dielectric film processes with deposition temperatures from 80°C to 400°C, catering to diverse requirements.
Advanced Packaging with SPTS Osprey® PECVD System
For advanced packaging applications, the SPTS Osprey® PECVD system excels in delivering low-temperature deposition processes compatible with 300mm substrates. Offering high-quality dielectric films at deposition temperatures as low as 110°C, this system provides reliability and stability over time. Optimized for hybrid bonding and inter-die applications, Osprey® PECVD enables tunable stress ranges for enhanced performance.
Innovative Molecular Vapor Deposition (MVD®) Technology from KLA
KLA's MVD systems, including the MVD100E for R&D and the MVD300/300E for high-volume manufacturing, utilize molecular vapor deposition to grow ultra-thin organic and inorganic films with superior efficiency. These systems find applications in moisture barriers, anti-corrosion coatings, and release layers for imprinting. With a focus on high performance, flexibility, and reliability, the MVD systems are key tools for both research labs and high-volume manufacturing.
MVD4500 for Large Substrates and Panels
The MVD4500 system is designed to handle large substrates and panels, offering the growth of ultra-thin organic and inorganic films for various applications. Capable of performing atomic layer deposition (ALD) and MVD on substrates up to 930 x 720 mm, this system ensures high performance, flexibility, and reliability for demanding manufacturing processes. With a focus on moisture barriers, anti-corrosion coatings, and release layers, the MVD4500 caters to a wide range of applications.
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