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Products-KLA YieldStar

Maximizing Chip Manufacturing Efficiency with KLA YieldStar Metrology Solutions

Archer™ Overlay Metrology Systems

KLA's Archer™ 750 overlay metrology system offers precise on-product overlay error feedback, crucial for achieving fast technology ramps and stable production of cutting-edge memory and logic devices. With wavelength tunability and 10nm resolution, this system ensures accurate overlay error measurements even in the presence of production process variations. The advanced algorithms and rAIM® overlay target design enhance the correlation between target and device overlay errors, enabling lithographers to accurately track device overlay performance.

ATL™ Overlay Metrology Systems

The ATL100™ scatterometry-based overlay metrology system by KLA provides overlay control for development and high-volume manufacturing at ≤7nm design nodes. Featuring tunable laser technology with 1nm resolution and real-time Homing™, the ATL100 maintains high overlay accuracy despite production process variations. It supports a wide range of scatterometry overlay measurement target designs, ensuring accurate overlay error measurement for various process layers, device types, design nodes, and patterning technologies.

Axion® X-ray Critical Dimension (CD) and Shape Metrology System

KLA's Axion® T2000 X-ray Metrology System offers high-resolution, fast, accurate, and non-destructive 3D shape measurements for advanced 3D NAND and DRAM chips. This system identifies subtle structural variations that can impact memory device performance and yield, providing inline, non-destructive measurements for rapid learning cycles during R&D and high-volume manufacturing. The Axion T2000 ensures quick issue identification and resolution, maintaining stable production.

SpectraShape™ Optical Critical Dimension (CD) and Shape Metrology Systems

The SpectraShape™ 11k metrology system is designed to fully characterize and monitor the critical dimensions and shapes of complex features on integrated circuits at leading-edge design nodes. Using advanced optical technologies and patented algorithms, this system identifies subtle variations in critical device parameters, supporting fast process issue identification inline. With improved throughput, SpectraShape 11k aids fabs in accelerating yield ramps and achieving stable production.

SpectraFilm™ Film Metrology Systems

KLA's SpectraFilm™ F1 system provides high-precision thin film measurements for sub-7nm logic and leading-edge memory design nodes. With spectroscopic ellipsometry technology and new FoG™ algorithms, this system offers accurate measurements of film thickness and insight into electrical performance early in the production process. Increased throughput ensures high productivity, supporting the growing number of film layers in leading-edge device fabrication.

Aleris® Film Metrology Systems

The Aleris® film metrology systems by KLA offer precise measurement of film thickness, refractive index, stress, and composition for advanced semiconductor technologies. Using Broadband Spectroscopic Ellipsometry (BBSE) technology, these systems provide comprehensive film thickness measurements and metrology solutions, enabling fabs to qualify and monitor a wide range of film layers effectively.

PWG™ Patterned Wafer Geometry (PWG) Metrology Systems

KLA's PWG™ patterned wafer metrology platform delivers comprehensive data on wafer shape, flatness, and nanotopography for advanced 3D NAND, DRAM, and logic manufacturing. With industry-leading dynamic range and high-resolution sampling, this system identifies process-induced wafer shape variations, enabling inline monitoring and control of wafer warp and stress. The PWG™ platform aids in improving on-product overlay and overall device yield by addressing issues at their source.

Therma-Probe® Implant Metrology Systems

KLA's Therma-Probe® ion implant/anneal metrology systems provide inline implant dose monitoring for various semiconductor technologies. These systems support advanced design node devices and compound semiconductor devices, ensuring accurate and efficient monitoring of implant doses during the manufacturing process. By enabling precise control and monitoring, the Therma-Probe® systems contribute to maximizing chip manufacturing efficiency and overall device performance.

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Revolutionizing Advanced Packaging with KLA YieldStar Wafer Processing Systems

KLA YieldStar Wafer Processing Systems Overview

KLA's YieldStar Wafer Processing Systems offer cutting-edge plasma etch and deposition process technologies tailored for advanced packaging schemes. From High-Density Fan-Out Wafer-Level Packaging (FOWLP) to intricate 3D packages featuring stacked die interconnected with through-silicon vias (TSV), KLA's solutions cater to a wide array of advanced packaging needs. These systems leverage KLA's extensive expertise in silicon etching, providing innovative plasma dicing solutions for dicing before or after grind processes on wafers up to 300mm in diameter. With a focus on precise process control and reliable production-proven methods, KLA enables chip manufacturers to reduce production costs while enhancing reliability, performance, and the integration of multiple functions.

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Empowering IoT Device Production with KLA YieldStar

Meeting the Demand for IoT Devices

In today's technological landscape, the Internet of Things (IoT) has propelled semiconductors to the forefront of every industry. The demand for low-cost devices with high-volume production capabilities and a variety of chip types, including those designed for 200mm and large design-rule nodes, has skyrocketed. To cater to this demand, fabs are upgrading and utilizing certified and remanufactured tools, originally introduced for cutting-edge design nodes. This surge in demand is fueled by the necessity for more mobile, automotive, and industrial IoT devices.

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Accelerating Reliability for Automotive Electronics with KLA YieldStar

Continuous Improvement Program for Automotive Fabs

Semiconductors and electronic components play a crucial role in driving innovation within the automotive industry. To ensure the reliability and quality of automotive electronics, KLA YieldStar offers a Continuous Improvement Program (CIP). This program leverages unpatterned wafer defect inspection to pinpoint the specific process tools responsible for defects. By implementing a tool monitoring CIP, automotive fabs can establish concrete targets for reducing process defects that impact reliability. This proactive approach allows manufacturers to enhance the overall quality of automotive electronics and drive continuous improvement.

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Enhancing Wafer Quality with KLA YieldStar Metrology Solution

Wafer Manufacturing Portfolio Overview

KLA's wafer manufacturing portfolio comprises defect inspection, review, metrology, and data management systems that play a crucial role in ensuring quality throughout the wafer fabrication process. These specialized tools not only assess wafer surface quality but also detect, count, and bin defects during production, thereby significantly contributing to outgoing wafer qualification. Moreover, wafer geometry systems ensure that the wafer shape remains extremely flat and uniform in thickness, with precise control over wafer shape topography. Additionally, data analysis and management systems proactively identify and address wafer/substrate fabrication process excursions that could potentially lead to yield loss.

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Enabling 5G Connectivity with KLA YieldStar

The Impact of 5G on Connectivity

The evolution towards 5G technology signifies a significant shift in how our interconnected systems function. Beyond enhancing the speed of mobile browsing, 5G plays a pivotal role in facilitating seamless interactions between various systems, empowered by advancements in artificial intelligence. For instance, V2X communication in vehicles utilizes 5G to enhance safety and optimize traffic management through constant monitoring and communication with the environment. Furthermore, the utilization of KLA's cutting-edge technologies enables the production of thinner and lighter advanced displays crucial for numerous 5G devices.

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