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Products-KLA YieldStar

KLA YieldStar: Revolutionizing Semiconductor Software Solutions

Klarity® Automated Defect and Yield Data Analysis

KLA's Klarity® Defect system provides real-time excursion identification, automating defect analysis to accelerate yield learning cycles. Klarity® SSA enhances defect classification, aiding in process issue detection. Klarity® ACE XP enables yield sharing across fabs for faster yield acceleration. These systems support lot dispositioning, defect source analysis, and excursion notifications, reducing inspection, classification, and review data workload.

OVALiS On‐product Process Optimization, Diagnostics, Monitoring and Control

The OVALiS suite optimizes semiconductor lithography processes by combining metrology data with fab automation context. Through simulation and diagnostics, OVALiS aids in on-product performance improvement, seamlessly integrating with SPC, FDC, and yield management systems for enhanced control.

5D Analyzer® Advanced Data Analysis and Patterning Control

KLA's 5D Analyzer® supports analytics and visualization for process optimization, monitoring, and patterning control in advanced node semiconductor production. Handling data from different fab sources, it enables offline and real-time applications like overlay analysis and reticle-wafer shape correlation for superior patterning control.

aiSIGHT™ Pattern-Centric Defect and Metrology Software Solution

aiSIGHT™ utilizes acquired SEM images and chip design data to provide comprehensive defect and pattern measurement information. By uncovering valuable insights from SEM images, aiSIGHT™ enables detailed defect analysis and efficient yield improvement strategies for chip manufacturers.

Anchor Pattern Centric Yield Manager

The Anchor Pattern Centric Yield Manager automates design decomposition and pattern scoring, enabling efficient risk assessment and defect sampling strategies. By leveraging the Design Decomposition Database™ and SEM image data, it offers pattern risk feedback to lithography teams for improved process control.

SPOT® Automated Predictive Analytics for Fab Process and Yield Management

SPOT® is a production machine learning platform for chip fabs, enhancing defect capture rate through advanced machine learning models. By analyzing inspection data, SPOT® optimizes review sample plans, leading to increased detection of critical defects and improved process and yield management.

I-PAT® Inline Die-Level Screening

KLA's I-PAT® method allows automobile manufacturers to identify and exclude die with latent reliability defects. By screening die inline, I-PAT® helps reduce the incidence of premature die failures, improving the quality of semiconductor electronic components supplied to the automotive industry.

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Optimizing PCB and IC Substrate Manufacturing with KLA YieldStar Chemistry Process Control

Enhancing Plating and Coating Chemistries

KLA's chemistry process control products, including the KLA YieldStar, play a vital role in optimizing various processes within the printed circuit board (PCB) and IC substrate manufacturing environments. These products facilitate the analysis and monitoring of plating and coating chemistries, ensuring the highest quality outcomes. Through the utilization of a patented cyclic voltametric stripping (CVS) technique, the KLA YieldStar effectively analyzes PCB plating baths, providing crucial insights to support optimal plating processes.

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Revolutionizing Solder Mask Imaging with KLA YieldStar Direct Imaging Solutions

Highly Accurate Direct Imaging for Solder Mask Applications

KLA's direct imaging (DI) solutions for solder mask (SM) go beyond traditional imaging techniques to offer high-accuracy, high-quality imaging with impressive production throughput capabilities. These cutting-edge solutions cater to a wide range of solder mask designs, from simple to highly complex configurations. Whether it's high-density interconnects (HDI), multi-layer boards (MLB), flexible printed circuit boards (FPCB), or specialized white solder mask applications like miniLED backlight units, KLA's solutions ensure consistently precise imaging quality at a low total cost of ownership.

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Maximizing Chip Manufacturing Efficiency with KLA YieldStar Metrology Solutions

Archer™ Overlay Metrology Systems

KLA's Archer™ 750 overlay metrology system offers precise on-product overlay error feedback, crucial for achieving fast technology ramps and stable production of cutting-edge memory and logic devices. With wavelength tunability and 10nm resolution, this system ensures accurate overlay error measurements even in the presence of production process variations. The advanced algorithms and rAIM® overlay target design enhance the correlation between target and device overlay errors, enabling lithographers to accurately track device overlay performance.

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Revolutionizing Advanced Packaging with KLA YieldStar Wafer Processing Systems

KLA YieldStar Wafer Processing Systems Overview

KLA's YieldStar Wafer Processing Systems offer cutting-edge plasma etch and deposition process technologies tailored for advanced packaging schemes. From High-Density Fan-Out Wafer-Level Packaging (FOWLP) to intricate 3D packages featuring stacked die interconnected with through-silicon vias (TSV), KLA's solutions cater to a wide array of advanced packaging needs. These systems leverage KLA's extensive expertise in silicon etching, providing innovative plasma dicing solutions for dicing before or after grind processes on wafers up to 300mm in diameter. With a focus on precise process control and reliable production-proven methods, KLA enables chip manufacturers to reduce production costs while enhancing reliability, performance, and the integration of multiple functions.

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Empowering IoT Device Production with KLA YieldStar

Meeting the Demand for IoT Devices

In today's technological landscape, the Internet of Things (IoT) has propelled semiconductors to the forefront of every industry. The demand for low-cost devices with high-volume production capabilities and a variety of chip types, including those designed for 200mm and large design-rule nodes, has skyrocketed. To cater to this demand, fabs are upgrading and utilizing certified and remanufactured tools, originally introduced for cutting-edge design nodes. This surge in demand is fueled by the necessity for more mobile, automotive, and industrial IoT devices.

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