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Products-KLA YieldStar

Enhancing Wafer Quality with KLA YieldStar Metrology Solution

Wafer Manufacturing Portfolio Overview

KLA's wafer manufacturing portfolio comprises defect inspection, review, metrology, and data management systems that play a crucial role in ensuring quality throughout the wafer fabrication process. These specialized tools not only assess wafer surface quality but also detect, count, and bin defects during production, thereby significantly contributing to outgoing wafer qualification. Moreover, wafer geometry systems ensure that the wafer shape remains extremely flat and uniform in thickness, with precise control over wafer shape topography. Additionally, data analysis and management systems proactively identify and address wafer/substrate fabrication process excursions that could potentially lead to yield loss.

In Situ Process Monitoring and Solutions

KLA's wafer manufacturing systems also include in situ process monitoring solutions, which assist engineers in visualizing, diagnosing, and controlling process and wafer handling conditions. These solutions prove to be invaluable in supporting process development, production monitoring, and final quality checks for a wide array of substrate types and sizes, including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers. By offering comprehensive support across various materials and sizes, KLA enables manufacturers to optimize their processes efficiently.

WaferSight™ 2+ Bare Wafer Geometry Metrology System

The WaferSight™ 2+ bare wafer geometry metrology system stands out as a key offering from KLA, specifically designed to qualify polished and epitaxial silicon wafers, engineered substrates, and other advanced materials. This system excels in producing critical data related to wafer flatness, dual-sided nanotopography, and high-resolution edge roll-off. Such data assists wafer manufacturers in ensuring the production of top-quality substrates at scale, thereby enhancing overall manufacturing efficiency and output.

MicroSense® Wafer Series for Bare Wafer Geometry Metrology

The MicroSense® bare wafer geometry metrology systems serve as another top-notch solution provided by KLA to aid wafer manufacturers in qualifying substrates across a diverse range of materials, sizes, and shapes. Leveraging patented non-contact sensor technology, these systems deliver precise and accurate automated geometry measurements at high throughput rates. By generating SEMI standard metrics and full wafer maps encompassing thickness, flatness, and shape (bow/warp), the MicroSense systems assist manufacturers in not only qualifying but also optimizing their processes, ensuring the mass production of superior-quality substrates.

Legacy Node Wafer Manufacturing Support

For legacy node wafer manufacturing needs, KLA offers systems such as the Surfscan® SP1 and SP2 Series unpatterned wafer inspectors through Pro Systems and Enhancements. These solutions cater to the specific requirements of legacy node processes, ensuring that even older manufacturing methods benefit from advanced inspection and quality control capabilities. By providing tailored support for legacy nodes, KLA demonstrates its commitment to assisting manufacturers across different technology stages, ultimately enhancing wafer quality across the industry.

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Enabling 5G Connectivity with KLA YieldStar

The Impact of 5G on Connectivity

The evolution towards 5G technology signifies a significant shift in how our interconnected systems function. Beyond enhancing the speed of mobile browsing, 5G plays a pivotal role in facilitating seamless interactions between various systems, empowered by advancements in artificial intelligence. For instance, V2X communication in vehicles utilizes 5G to enhance safety and optimize traffic management through constant monitoring and communication with the environment. Furthermore, the utilization of KLA's cutting-edge technologies enables the production of thinner and lighter advanced displays crucial for numerous 5G devices.

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Enhancing Advanced Wafer-Level Packaging with KLA YieldStar Technology

Kronos™ 1190: Leading the Way in Wafer-Level Packaging Inspection

The Kronos™ 1190 patterned wafer inspection system from KLA YieldStar is at the forefront of wafer-level packaging inspection technology. With high resolution optics, this system offers best-in-class sensitivity to critical defects, making it a valuable tool for process development and production monitoring in advanced wafer-level packaging applications such as 3D IC and high-density fan-out. The system integrates Artificial Intelligence (AI) through DefectWise®, boosting sensitivity, productivity, and classification accuracy to tackle overkill and defect escape challenges. Additionally, DesignWise® refines inspection areas based on direct design input, resulting in reduced nuisance factors and improved inspection efficiency. The Kronos™ 1190 system is capable of inspecting bonded, thinned, warped, and diced substrates, providing cost-effective defect inspection down to 150nm in critical process steps like post-dicing, pre-bonding, and patterning of Cu pads, Cu pillars, bumps, through-silicon vias (TSVs), and redistribution layers (RDL).

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Advancements in Broadband Plasma Patterned Wafer Defect Inspection Systems by KLA YieldStar

3935 and 3920 EP Systems

KLA's 3935 and 3920 EP broadband plasma defect inspection systems are designed to offer support for wafer-level defect discovery, yield learning, and inline monitoring for logic nodes of ≤5nm and leading-edge memory design nodes. These systems utilize a light source that generates super resolution deep ultraviolet (SR-DUV) wavelength bands, coupled with low noise sensors and advanced algorithms, to ensure high sensitivity detection of unique defect types. The 3935 system incorporates technologies like Setup 2.0 infrastructure for scalable enhancements to inspection recipe setup and DualSENS™ linkage for enhanced defect sensitivity on low contrast layers. On the other hand, the 3920 EP is equipped with memory-specific algorithms and binning innovations to facilitate the capture and monitoring of critical defects specifically for 3D NAND and DRAM devices. Both the 3935 and 3920 EP devices boast throughput capabilities that cater to inline monitoring requirements, combining sensitivity with speed to deliver quick data for complete process issue characterization during development and high volume manufacturing.

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Elevating Chip Manufacturing with KLA YieldStar

Advanced Solutions for Chip Manufacturing

KLA's YieldStar is a cutting-edge process control and process enabling solution that plays a critical role in supporting chip manufacturing across various device types. From advanced logic and memory technologies such as 3D NAND, DRAM, and MRAM to power devices, RF communications devices, LEDs, photonics, and MEMS, KLA YieldStar offers a comprehensive suite of tools to enhance the fabrication process.

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Optimizing Manufacturing Processes with KLA YieldStar Software Solutions

Challenges in Semiconductor and PCB Manufacturing

Manufacturing facilities in the electronics industry face significant challenges with managing intricate processes across various components like wafers, reticles, chips, packaging, and PCBs. The complexity of these processes leaves very little room for error, emphasizing the need for precise data management and analysis.

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