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Products-KLA YieldStar

Enhancing Advanced Wafer-Level Packaging with KLA YieldStar Technology

Kronos™ 1190: Leading the Way in Wafer-Level Packaging Inspection

The Kronos™ 1190 patterned wafer inspection system from KLA YieldStar is at the forefront of wafer-level packaging inspection technology. With high resolution optics, this system offers best-in-class sensitivity to critical defects, making it a valuable tool for process development and production monitoring in advanced wafer-level packaging applications such as 3D IC and high-density fan-out. The system integrates Artificial Intelligence (AI) through DefectWise®, boosting sensitivity, productivity, and classification accuracy to tackle overkill and defect escape challenges. Additionally, DesignWise® refines inspection areas based on direct design input, resulting in reduced nuisance factors and improved inspection efficiency. The Kronos™ 1190 system is capable of inspecting bonded, thinned, warped, and diced substrates, providing cost-effective defect inspection down to 150nm in critical process steps like post-dicing, pre-bonding, and patterning of Cu pads, Cu pillars, bumps, through-silicon vias (TSVs), and redistribution layers (RDL).

CIRCL™-AP: Comprehensive All-Surface Wafer Defect Inspection and Metrology

The CIRCL™-AP cluster system is a versatile tool provided by KLA YieldStar for all-surface inspection, metrology, and review in advanced wafer-level packaging processes. Designed to offer high-throughput performance, the CIRCL™-AP cluster system is essential for efficient process control of various advanced packaging applications like 2.5D/3D integration, wafer-level chip scale packaging (WLCSP), and fan-out wafer-level packaging (FOWLP). Supporting bonded, thinned, and warped substrates, this system ensures production-proven process control for critical packaging elements like Cu pillars, bumps, through silicon vias (TSVs), and redistribution layers (RDL). By providing high sensitivity and efficiency, the CIRCL™-AP system enables chip manufacturers to streamline their packaging processes and enhance overall quality control.

PWG5™ with XT Option: Precision Patterned Wafer Metrology for Thick Wafers

The PWG5™ with XT Option from KLA YieldStar is a patterned wafer metrology platform that focuses on eXtra Thick wafers, particularly in wafer-to-wafer bonding applications. This system produces dense shape data, comprehensive wafer flatness data, and dual-sided nanotopography information critical for monitoring wafer shape in bonding processes. The XT Option, an add-on feature for the PWG5™, leverages novel enhancements, additional calibration, and passivation technologies to ensure high precision and stability in measuring thick wafers. With advanced handling capabilities and high-resolution measurement techniques, the PWG5™ with XT Option enables manufacturers to achieve superior control and yield improvements in the wafer-to-wafer bonding process, addressing issues such as void detection, bonding chuck hotspot identification, and overall process monitoring.

irArcher®: Advancing Overlay Metrology in Wafer-to-Wafer Bonding

The innovative irArcher® 007 overlay metrology system by KLA YieldStar is a robust solution for characterizing and monitoring overlay performance in advanced wafer-to-wafer alignment bonding processes. By utilizing short wavelength infrared (SWIR) illumination modes, the irArcher® 007 system ensures accurate overlay measurements on pre-grinded bonded wafers with minimal noise interference. The system's focus system delivers fast, reliable overlay measurements for within-wafer and wafer-to-wafer applications, supporting multiple bonders in manufacturing facilities. With features like full factory automation, advanced process control infrastructure, and high-bow wafer handling capabilities, the irArcher® 007 system is tailored for processes involving 3D heterogeneous integration, enabling engineers to monitor and enhance alignment accuracy and final product yield effectively.

Zeta™-5xx/6xx: Automated Metrology Systems for Advanced Packaging

The Zeta™-5xx Series optical profilers offered by KLA YieldStar are advanced, fully automated 300mm wafer metrology systems designed for precise measurement across various applications in advanced wafer-level packaging. These systems can accurately measure bump height, redistribution layer (RDL) critical dimensions, under bump metallization (UBM) step height, film thickness, and wafer bow, crucial parameters for process control in the packaging industry. With multi-mode optics that support a wide variety of measurement types, the Zeta™-5xx Series profilers deliver high-resolution 3D images and detailed analysis, empowering manufacturers with the data needed to drive yield improvement through process feedback cycles. For panel-based wafer-level packaging applications, the Zeta™-6xx Series profilers extend the same level of metrology measurement capability available in the 5xx Series, enabling comprehensive process control and optimization.

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Advancements in Broadband Plasma Patterned Wafer Defect Inspection Systems by KLA YieldStar

3935 and 3920 EP Systems

KLA's 3935 and 3920 EP broadband plasma defect inspection systems are designed to offer support for wafer-level defect discovery, yield learning, and inline monitoring for logic nodes of ≤5nm and leading-edge memory design nodes. These systems utilize a light source that generates super resolution deep ultraviolet (SR-DUV) wavelength bands, coupled with low noise sensors and advanced algorithms, to ensure high sensitivity detection of unique defect types. The 3935 system incorporates technologies like Setup 2.0 infrastructure for scalable enhancements to inspection recipe setup and DualSENS™ linkage for enhanced defect sensitivity on low contrast layers. On the other hand, the 3920 EP is equipped with memory-specific algorithms and binning innovations to facilitate the capture and monitoring of critical defects specifically for 3D NAND and DRAM devices. Both the 3935 and 3920 EP devices boast throughput capabilities that cater to inline monitoring requirements, combining sensitivity with speed to deliver quick data for complete process issue characterization during development and high volume manufacturing.

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Elevating Chip Manufacturing with KLA YieldStar

Advanced Solutions for Chip Manufacturing

KLA's YieldStar is a cutting-edge process control and process enabling solution that plays a critical role in supporting chip manufacturing across various device types. From advanced logic and memory technologies such as 3D NAND, DRAM, and MRAM to power devices, RF communications devices, LEDs, photonics, and MEMS, KLA YieldStar offers a comprehensive suite of tools to enhance the fabrication process.

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Optimizing Manufacturing Processes with KLA YieldStar Software Solutions

Challenges in Semiconductor and PCB Manufacturing

Manufacturing facilities in the electronics industry face significant challenges with managing intricate processes across various components like wafers, reticles, chips, packaging, and PCBs. The complexity of these processes leaves very little room for error, emphasizing the need for precise data management and analysis.

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Enhancing Advanced Packaging Manufacturing with KLA YieldStar Chemistry Process Control

Advanced Packaging Manufacturing Solutions

KLA's chemistry process control products, such as the KLA YieldStar, play a pivotal role in supporting various applications within advanced packaging manufacturing. These products are designed to analyze and monitor the usage of wet chemicals in critical processes like wafer-level packaging (WLP), panel-level packaging (PLP), and IC substrates. Whether it's developing new packaging technologies or implementing fully automated online chemical monitoring solutions, KLA's products empower engineers to control and optimize advanced packaging processes with precision.

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Empowering Semiconductor Industry with KLA YieldStar: Legal Notices and Compliance

Forward-Looking Statements

KLA YieldStar, a cutting-edge solution by KLA Corporation, offers a glimpse into the future of the semiconductor industry. However, it's important to note that any forward-looking statements regarding future events or financial performance are predictions and may differ from actual results. Factors such as industry volatility, economic conditions, technological advancements, and legal considerations play a crucial role. To stay informed and up-to-date, referring to the documents filed with the Securities and Exchange Commission, like Form 10-K and Form 10-Q, is recommended.

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