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Products-KLA YieldStar

Empowering IoT Device Production with KLA YieldStar

Meeting the Demand for IoT Devices

In today's technological landscape, the Internet of Things (IoT) has propelled semiconductors to the forefront of every industry. The demand for low-cost devices with high-volume production capabilities and a variety of chip types, including those designed for 200mm and large design-rule nodes, has skyrocketed. To cater to this demand, fabs are upgrading and utilizing certified and remanufactured tools, originally introduced for cutting-edge design nodes. This surge in demand is fueled by the necessity for more mobile, automotive, and industrial IoT devices.

Advanced Nodes Driving Innovation

The evolution of IoT devices requires the utmost in advanced technology, such as the latest logic microprocessors, high-capacity memory chips, and leading-edge packaging integration. Advanced logic, DRAM, NAND flash, and other semiconductor devices that power the IoT are manufactured at advanced design nodes within 300mm fabs globally. This intricate chip manufacturing process, along with reticle manufacturing and packaging manufacturing, ensures the delivery of cutting-edge IoT solutions.

Specialty Semiconductors for IoT Applications

The smart devices in IoT applications, spanning mobile, home automation, automotive, industrial, AR/VR, and wearable tech, rely on high-performance computing and seamless communication between various sensors and the cloud. These sensors, such as MEMS, thermal, optical, and chemical sensors, drive the demand for innovative process control solutions. Specialty semiconductor etch and deposition processes, as well as PCB and IC substrate manufacturing, play an essential role in the development of IoT technologies.

Enhancing IoT Device Production with KLA YieldStar

KLA YieldStar offers cutting-edge solutions to enhance the production of IoT devices. Whether it's leveraging AI to accelerate IC production for the next generation of AI innovation, revolutionizing quality control for automotive ICs powering navigation and autonomous driving systems, or ensuring yield and reliability for 5G technology, KLA's offerings are at the forefront. By partnering with KLA YieldStar, companies can achieve more in the realm of IoT device production and innovation.

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Accelerating Reliability for Automotive Electronics with KLA YieldStar

Continuous Improvement Program for Automotive Fabs

Semiconductors and electronic components play a crucial role in driving innovation within the automotive industry. To ensure the reliability and quality of automotive electronics, KLA YieldStar offers a Continuous Improvement Program (CIP). This program leverages unpatterned wafer defect inspection to pinpoint the specific process tools responsible for defects. By implementing a tool monitoring CIP, automotive fabs can establish concrete targets for reducing process defects that impact reliability. This proactive approach allows manufacturers to enhance the overall quality of automotive electronics and drive continuous improvement.

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Enhancing Wafer Quality with KLA YieldStar Metrology Solution

Wafer Manufacturing Portfolio Overview

KLA's wafer manufacturing portfolio comprises defect inspection, review, metrology, and data management systems that play a crucial role in ensuring quality throughout the wafer fabrication process. These specialized tools not only assess wafer surface quality but also detect, count, and bin defects during production, thereby significantly contributing to outgoing wafer qualification. Moreover, wafer geometry systems ensure that the wafer shape remains extremely flat and uniform in thickness, with precise control over wafer shape topography. Additionally, data analysis and management systems proactively identify and address wafer/substrate fabrication process excursions that could potentially lead to yield loss.

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Enabling 5G Connectivity with KLA YieldStar

The Impact of 5G on Connectivity

The evolution towards 5G technology signifies a significant shift in how our interconnected systems function. Beyond enhancing the speed of mobile browsing, 5G plays a pivotal role in facilitating seamless interactions between various systems, empowered by advancements in artificial intelligence. For instance, V2X communication in vehicles utilizes 5G to enhance safety and optimize traffic management through constant monitoring and communication with the environment. Furthermore, the utilization of KLA's cutting-edge technologies enables the production of thinner and lighter advanced displays crucial for numerous 5G devices.

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Enhancing Advanced Wafer-Level Packaging with KLA YieldStar Technology

Kronos™ 1190: Leading the Way in Wafer-Level Packaging Inspection

The Kronos™ 1190 patterned wafer inspection system from KLA YieldStar is at the forefront of wafer-level packaging inspection technology. With high resolution optics, this system offers best-in-class sensitivity to critical defects, making it a valuable tool for process development and production monitoring in advanced wafer-level packaging applications such as 3D IC and high-density fan-out. The system integrates Artificial Intelligence (AI) through DefectWise®, boosting sensitivity, productivity, and classification accuracy to tackle overkill and defect escape challenges. Additionally, DesignWise® refines inspection areas based on direct design input, resulting in reduced nuisance factors and improved inspection efficiency. The Kronos™ 1190 system is capable of inspecting bonded, thinned, warped, and diced substrates, providing cost-effective defect inspection down to 150nm in critical process steps like post-dicing, pre-bonding, and patterning of Cu pads, Cu pillars, bumps, through-silicon vias (TSVs), and redistribution layers (RDL).

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Advancements in Broadband Plasma Patterned Wafer Defect Inspection Systems by KLA YieldStar

3935 and 3920 EP Systems

KLA's 3935 and 3920 EP broadband plasma defect inspection systems are designed to offer support for wafer-level defect discovery, yield learning, and inline monitoring for logic nodes of ≤5nm and leading-edge memory design nodes. These systems utilize a light source that generates super resolution deep ultraviolet (SR-DUV) wavelength bands, coupled with low noise sensors and advanced algorithms, to ensure high sensitivity detection of unique defect types. The 3935 system incorporates technologies like Setup 2.0 infrastructure for scalable enhancements to inspection recipe setup and DualSENS™ linkage for enhanced defect sensitivity on low contrast layers. On the other hand, the 3920 EP is equipped with memory-specific algorithms and binning innovations to facilitate the capture and monitoring of critical defects specifically for 3D NAND and DRAM devices. Both the 3935 and 3920 EP devices boast throughput capabilities that cater to inline monitoring requirements, combining sensitivity with speed to deliver quick data for complete process issue characterization during development and high volume manufacturing.

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