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Products-KLA YieldStar

Accelerating Reliability for Automotive Electronics with KLA YieldStar

Continuous Improvement Program for Automotive Fabs

Semiconductors and electronic components play a crucial role in driving innovation within the automotive industry. To ensure the reliability and quality of automotive electronics, KLA YieldStar offers a Continuous Improvement Program (CIP). This program leverages unpatterned wafer defect inspection to pinpoint the specific process tools responsible for defects. By implementing a tool monitoring CIP, automotive fabs can establish concrete targets for reducing process defects that impact reliability. This proactive approach allows manufacturers to enhance the overall quality of automotive electronics and drive continuous improvement.

Zero Defect Screening for Improved Quality Control

One of the key solutions provided by KLA YieldStar is the Zero Defect Screening method. This approach involves monitoring 100% of die on all wafers at critical process steps to ensure zero defects. By utilizing inspectors that are fast, sensitive, and accurate in defect identification, KLA enables fabs to eliminate faulty die at the earliest stage within the supply chain, minimizing costs. The high sensitivity inspection strategy combined with screening techniques allows for the detection of yield-critical defects, facilitating faster characterization of new processes and further reducing defects, ultimately enhancing yield and quality standards.

Enhanced IC Packaging and PCB Quality Control

In the realm of advanced packaging technology, KLA YieldStar's inspection and metrology systems are instrumental in capturing critical defects and variations. These systems play a vital role in continuous improvement processes for IC components, IC substrates, and printed circuit boards (PCBs). By implementing rigorous screening and sorting procedures, defective devices are prevented from progressing in the supply chain. This quality control step not only addresses reliability-related issues but also ensures traceability of device failures. KLA's solutions in this area contribute significantly to enhancing the performance and integration of IC components in automotive electronics.

Power Device Reliability and Process Control

Power devices are integral to various automotive subsystems and demand stringent quality standards akin to other automotive ICs. KLA YieldStar offers specialized equipment tailored for SiC epitaxy and GaN-on-silicon processes, as well as inspection systems for SiC substrates. These solutions empower power device manufacturers to achieve automotive defect standards and uphold reliability. By focusing on wafer process control, specialty semiconductor etch and deposition processes, and power device process control, KLA's technology ensures the reliability and performance of power devices used in automotive applications.

Inline Defect Part Average Testing (I-PAT) Innovation

A cutting-edge innovation by KLA YieldStar is the Inline Defect Part Average Testing (I-PAT) method. This groundbreaking approach allows automobile manufacturers to mitigate latent reliability defects in semiconductor electronic components effectively. With I-PAT, manufacturers can pinpoint at-risk die, exclude them from the supply chain, and reduce the occurrence of premature die failures. By incorporating advanced testing methodologies like I-PAT, automotive fabs can elevate the reliability and quality of their electronic components to meet industry standards and customer expectations.

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Enhancing Wafer Quality with KLA YieldStar Metrology Solution

Wafer Manufacturing Portfolio Overview

KLA's wafer manufacturing portfolio comprises defect inspection, review, metrology, and data management systems that play a crucial role in ensuring quality throughout the wafer fabrication process. These specialized tools not only assess wafer surface quality but also detect, count, and bin defects during production, thereby significantly contributing to outgoing wafer qualification. Moreover, wafer geometry systems ensure that the wafer shape remains extremely flat and uniform in thickness, with precise control over wafer shape topography. Additionally, data analysis and management systems proactively identify and address wafer/substrate fabrication process excursions that could potentially lead to yield loss.

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Enabling 5G Connectivity with KLA YieldStar

The Impact of 5G on Connectivity

The evolution towards 5G technology signifies a significant shift in how our interconnected systems function. Beyond enhancing the speed of mobile browsing, 5G plays a pivotal role in facilitating seamless interactions between various systems, empowered by advancements in artificial intelligence. For instance, V2X communication in vehicles utilizes 5G to enhance safety and optimize traffic management through constant monitoring and communication with the environment. Furthermore, the utilization of KLA's cutting-edge technologies enables the production of thinner and lighter advanced displays crucial for numerous 5G devices.

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Enhancing Advanced Wafer-Level Packaging with KLA YieldStar Technology

Kronos™ 1190: Leading the Way in Wafer-Level Packaging Inspection

The Kronos™ 1190 patterned wafer inspection system from KLA YieldStar is at the forefront of wafer-level packaging inspection technology. With high resolution optics, this system offers best-in-class sensitivity to critical defects, making it a valuable tool for process development and production monitoring in advanced wafer-level packaging applications such as 3D IC and high-density fan-out. The system integrates Artificial Intelligence (AI) through DefectWise®, boosting sensitivity, productivity, and classification accuracy to tackle overkill and defect escape challenges. Additionally, DesignWise® refines inspection areas based on direct design input, resulting in reduced nuisance factors and improved inspection efficiency. The Kronos™ 1190 system is capable of inspecting bonded, thinned, warped, and diced substrates, providing cost-effective defect inspection down to 150nm in critical process steps like post-dicing, pre-bonding, and patterning of Cu pads, Cu pillars, bumps, through-silicon vias (TSVs), and redistribution layers (RDL).

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Advancements in Broadband Plasma Patterned Wafer Defect Inspection Systems by KLA YieldStar

3935 and 3920 EP Systems

KLA's 3935 and 3920 EP broadband plasma defect inspection systems are designed to offer support for wafer-level defect discovery, yield learning, and inline monitoring for logic nodes of ≤5nm and leading-edge memory design nodes. These systems utilize a light source that generates super resolution deep ultraviolet (SR-DUV) wavelength bands, coupled with low noise sensors and advanced algorithms, to ensure high sensitivity detection of unique defect types. The 3935 system incorporates technologies like Setup 2.0 infrastructure for scalable enhancements to inspection recipe setup and DualSENS™ linkage for enhanced defect sensitivity on low contrast layers. On the other hand, the 3920 EP is equipped with memory-specific algorithms and binning innovations to facilitate the capture and monitoring of critical defects specifically for 3D NAND and DRAM devices. Both the 3935 and 3920 EP devices boast throughput capabilities that cater to inline monitoring requirements, combining sensitivity with speed to deliver quick data for complete process issue characterization during development and high volume manufacturing.

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Elevating Chip Manufacturing with KLA YieldStar

Advanced Solutions for Chip Manufacturing

KLA's YieldStar is a cutting-edge process control and process enabling solution that plays a critical role in supporting chip manufacturing across various device types. From advanced logic and memory technologies such as 3D NAND, DRAM, and MRAM to power devices, RF communications devices, LEDs, photonics, and MEMS, KLA YieldStar offers a comprehensive suite of tools to enhance the fabrication process.

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