Revolutionizing Semiconductor Design with Cadence Virtuoso Heterogeneous Integration

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Revolutionizing Semiconductor Design with Cadence Virtuoso Heterogeneous Integration

Accelerating Heterogeneous Integration with Virtuoso Studio

Cadence Virtuoso Heterogeneous Integration provides a cutting-edge solution for designing 2.5D and 3D systems that combine mixed-signal, photonics, and RF circuits. By integrating different types of semiconductors into a single system, designers can achieve size and power reduction while enhancing performance across various domains. This innovative approach allows for the implementation of chiplets with optimal processes, resulting in cost reductions and faster time-to-market. The platform's advanced features enable designers to address complex heterogeneous design challenges through multi-fabric co-analysis of electrical, electromagnetic (EM), and photonic signals. Additionally, Virtuoso Studio supports system-level integration and verification, including power and thermal analysis.

Key Benefits of Virtuoso Heterogeneous Integration

With the Edit-in-Concert technology, multiple users can collaboratively edit IC, package, and board designs in real-time. This coordinated editing process ensures seamless integration across different fabrics, enhancing design efficiency and accuracy. The platform also facilitates cross-fabric analysis and signoff, allowing designers to include entire nets spanning IC, package, and board domains. Virtuoso's interoperability with the Allegro platform enables flexible design workflows, empowering users to work seamlessly between different environments. Moreover, the True Multi-Technology Environment in Virtuoso Studio supports concurrent use of multiple Process Design Kits (PDKs) for system-level designs, offering versatility and adaptability.

Advanced Features for Comprehensive System Implementation

Virtuoso Heterogeneous Integration offers an array of features to support the design of complete systems. The Edit-in-Concert technology enables simultaneous editing across fabrics, ensuring accurate connectivity and manufacturability at the system level. Designers can seamlessly integrate RFIC, photonic IC (PIC), and system-in-package (SiP) modules within a unified environment. The platform's cross-fabric analysis and signoff capabilities empower users to simulate system schematics, extract full designs, and validate layouts at a system level. These features are essential for addressing the complexities of modern RF and photonics cross-fabric flows.

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