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Products-Cadence Virtuoso

Revolutionizing Electronic Systems Design with Cadence Celsius Studio

Unified AI Thermal Analysis

Cadence Celsius Studio stands out as the industry's first complete AI-enabled thermal platform for electronic systems. It offers a comprehensive solution for thermal analysis, thermal stress evaluation, and electronics cooling. Unlike existing point tool options, Celsius Studio introduces a revolutionary approach with a unified platform. This platform empowers both electrical and mechanical/thermal engineers to design and analyze simultaneously within a single interface. This eliminates the need for geometry simplification, manipulation, or translation, streamlining the design process.

Key Benefits of Celsius Studio

The key benefits of leveraging Cadence Celsius Studio include unlocking efficiency and precision while gaining innovative insights, saving design time, and optimizing resources. Through in-design analysis, the platform harnesses the synergy of Cadence's robust technology portfolio, elevating electronic design to new heights. Design Insight enables engineers to explore the full design space rapidly and efficiently, converging on the optimal design with integrated AI-driven technology. Furthermore, the platform allows for complete system thermal analysis by combining finite element method (FEM) with computational fluid dynamics (CFD) for a thorough analysis.

Applications of Celsius Studio

Celsius Studio is instrumental in solving complex thermal challenges across various domains. For SoC design, engineers can optimize floorplans, analyze performance under thermal constraints, and pinpoint temperature sensor locations accurately. Additionally, the platform supports thermal analysis in MMIC design, IC packaging, and PCB design, providing a versatile solution for addressing diverse thermal management needs in electronic systems.

Capabilities and Electrothermal Innovation

Cadence Celsius Studio offers fast, reliable thermal analysis for systems and beyond. By implementing complete shift-left, in-design thermal analysis, the platform aims to detect and prevent defects early in the design process. This strategy seamlessly integrates thermal analysis from chip to PCB to system level. Leveraging AI and machine learning technologies, Celsius Studio optimizes component integration, enhancing system efficiency and performance across industries like automotive and biomedical markets. The platform excels in electrothermal innovation, mechanical stress analysis, and AI-enabled optimization.

Product Highlights and Features

The Celsius Studio Platform highlights its early thermal simulation capabilities, enabling designers to preempt costly implementations, engineering delays, and field failures. Through multiphysics technology and field solvers, the platform combines robust FEA solvers with advanced finite-element method (FEM) meshing technology, streamlining the meshing process for complex systems. Other features include transient and steady-state analysis for accurate electrothermal co-simulation, massively parallelized execution for faster performance, and seamless integration with Cadence IC, package, microwave/RF, and PCB implementation platforms.

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Optimizing Arm-Based SoC Designs with Cadence Virtuoso

Maximizing Performance and Energy Efficiency

Cadence Virtuoso, in collaboration with Arm, provides optimized solutions for Arm-based system-on-chip (SoC) designs. By leveraging Cadence's digital and mixed-signal design methodologies and Arm's processors like Cortex-A, Cortex-R, and Cortex-M, designers can achieve superior performance, power efficiency, and area optimization. This partnership streamlines the design and verification processes, making it easier to create products such as IoT devices, mobile phones, high-performance servers, and embedded applications.

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Innovative 5G System and Subsystem Design Solutions with Cadence Virtuoso

Revolutionizing 5G Technology

In the era of next-generation 5G/6G systems, connectivity to the internet is about to reach unprecedented levels with features like extreme capacity, vast coverage, high reliability, and ultra-low latency. Cadence Virtuoso's extensive portfolio of advanced design tools and IP offers a solution to the challenges posed by 5G system designs. The demands of utilizing the millimeter wave (mmWave) radio frequency spectrum for handsets and infrastructure necessitate fundamental changes in system architecture. With Cadence Virtuoso, designers can create high-complexity electronic-centric systems like SoCs, RFICs, power amplifiers, transceivers, packages, or RF PCBs that meet the stringent requirements of 5G technology. These requirements include high data rates, a large number of connected devices, reliability, security, low latency, and prolonged battery life.

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Cadence Virtuoso: Empowering Design Teams with Comprehensive Support

Cadence Support Offerings

Cadence is dedicated to ensuring design teams are highly productive by offering a range of support solutions aimed at reducing time to market and achieving silicon success. The Global Customer Support structure provides customers with access to a broad knowledge base of articles and quick assistance from Cadence technical experts. From basic to premium support, Cadence is committed to keeping your design effort at its peak productivity.

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Unleashing the Power of IC Package Design with Cadence Virtuoso

IC Package Design Overview

Cadence Virtuoso offers a comprehensive solution for IC package design, empowering engineers to create cutting-edge integrated circuits with efficiency and precision. Through their training services, Cadence provides learning maps that guide customers through a complete learning plan, covering all Cadence technologies and reference courses available worldwide. These learning maps recommend course flows tailored to individual tool experience and knowledge levels, ensuring a seamless learning journey for users.

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Cadence Virtuoso AI IP Platform: Powering Edge to on-Device AI Solutions

Empowering SoC Developers with Cutting-Edge AI IP Solutions

Cadence Virtuoso AI IP platform offers a comprehensive solution for developers to design and deliver optimal AI solutions for a wide array of applications and markets. With a range of IP options including Neo NPUs, Tensilica AI Base, and AI Boost, SoC developers can meet the demands for power, performance, and area (PPA) behind the NeuroWeave SDK common software platform. These IP options provide scalable and energy-efficient on-device to edge AI processing, essential for today's AI/ML SoCs in various sectors like automotive, consumer electronics, industrial applications, and mobile devices.

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