Cadence Virtuoso 3D-IC Design Solutions: Revolutionizing Multi-Chiplet and Advanced IC Packaging

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Cadence Virtuoso 3D-IC Design Solutions: Revolutionizing Multi-Chiplet and Advanced IC Packaging

Revolutionizing Multi-Chiplet Design

Cadence Virtuoso's 3D-IC Design Solutions offer a comprehensive suite of tools and capabilities that span integration, packaging, custom and digital implementation, verification, system analysis, and interconnect IP for chiplet-based designs. This comprehensive solution serves as a one-stop shop for designers looking to embark on multi-chiplet design and advanced IC packaging projects. With a proven design flow, the Cadence 3D-IC solution provides seamless 3D design planning, implementation, and system analysis in a unified cockpit, enabling efficient hardware and software co-verification. This allows for full-system power analysis using emulation and prototyping, ensuring chiplet-based PHY IP connectivity optimized for power, performance, and area (PPA).

Key Benefits of Cadence Virtuoso 3D-IC Solutions

With over 25 years of expertise in advanced packaging, Cadence Virtuoso empowers its customers to achieve higher bandwidth, lower power consumption, and reduced area without relying solely on traditional process scaling. The 3D-IC solution enables heterogeneous integration of different dies for 2.5D or 3D designs, offering system-driven PPA to maximize power efficiency without compromising performance. Additionally, Cadence Virtuoso supports a wide range of applications in AI, data center, graphics, and mobile communications ICs with a smaller form factor, ensuring maximum functionality and versatility.

Comprehensive Offerings for 3D-IC Design

Cadence Virtuoso's 3D-IC Design Solutions address the diverse requirements of 3D-IC design for digital SoCs, analog/mixed-signal designs, and entire systems. The platform includes features such as multi-chiplet planning, design planning, logic die DFT, signoff and analysis, thermal management, multi-die physical verification, validation and power analysis, and chiplet-based IP. The Integrity 3D-IC Platform, based on Cadence's leading digital implementation solution, allows system-level designers to efficiently plan, implement, and analyze stacked die systems for various packaging styles (2.5D or 3D). By facilitating system analysis, including co-design, the platform seamlessly integrates with Cadence's Virtuoso and Allegro analog and package implementation environments, offering an industry-leading solution for multi-chiplet planning and implementation.

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Cadence Virtuoso: Empowering Mixed-Signal Design with Comprehensive Solutions

Cadence Virtuoso Mixed-Signal Solutions

Cadence Virtuoso offers a comprehensive, interoperable, and proven mixed-signal verification and implementation solution to address the challenges faced in today's complex designs. With over 20 years of experience catering to the mixed-signal design community, Cadence Virtuoso delivers a methodology that enhances design efficiency, throughput, and productivity.

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Maximizing Silicon Quality and Productivity with Cadence Virtuoso Advanced-Node Solutions

Overview of Cadence Virtuoso Advanced-Node Solutions

Cadence Virtuoso Advanced-Node Solutions offer a comprehensive, integrated, and silicon-proven design flow tailored for custom/analog, digital, and mixed-signal System-on-Chips (SoCs). This advanced solution is designed to help designers increase silicon quality, boost productivity, speed ramp to volume production, and manage yield effectively.

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Empower Your Workflow with Cadence Virtuoso's Doc Assistant

Overview of Doc Assistant

Cadence Virtuoso's Doc Assistant is a cutting-edge, cloud-based documentation viewer that seamlessly integrates with Cadence licensed software, offering users comprehensive support and information right within the software interface. This innovative tool is designed to provide on-the-spot, 24/7 assistance, ensuring users have immediate access to relevant documentation without the need to navigate away from their current workflow. By leveraging a cloud-based, topic-based document viewing approach, Doc Assistant significantly reduces dependencies on traditional, locally installed documentation, streamlining the user experience.

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Cadence Virtuoso - Comprehensive Low-Power Design Solution

Understanding the Need for Low-Power Design

In today's technologically advanced world, low-power design is critical across various industries, from wearables to automotive electronics. The Cadence Virtuoso low-power solution acknowledges that power management is integral to the entire design process, beginning from architectural planning to chip and system signoff. With the rising demand for energy-efficient devices, the focus on low-power design has never been more crucial.

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