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Maximizing Arm-Based SoC Design Efficiency with Cadence OrCAD

Optimizing Performance, Power, and Area (PPA)

Cadence OrCAD in collaboration with Arm provides a cutting-edge solution to maximize performance and energy efficiency for Arm-based SoCs. The joint effort of Cadence and Arm aims to streamline the design process, ensuring optimized performance, power consumption, and area utilization. This optimization is crucial for developing a wide range of products, including IoT devices, mobile devices, high-performance computing servers, and embedded applications.

Accelerated Design Process

The key benefits of utilizing Cadence OrCAD for Arm-based SoC designs include improved PPA metrics and expedited system verification. By leveraging the optimized tool flows provided by the partnership, designers can achieve the best performance, power efficiency, and area utilization for their SoCs. This acceleration in the design and verification processes enables faster time-to-market for innovative Arm-based products.

Comprehensive Solution Offerings

Cadence's offerings in partnership with Arm encompass a wide array of solutions and services tailored for Arm Cortex processors, Neoverse processors, Mali GPUs, CoreLink System IP, Artisan Physical IP, and more. These solutions range from digital and mixed-signal design methodologies to verification flows and IP integration, ensuring seamless compatibility with Arm's diverse product lineup. Whether it's SoC implementation, verification, compliance, or realization, Cadence OrCAD has the tools and expertise to support every stage of the design process.

Driving Automotive Innovation

Cadence and Arm are at the forefront of driving innovation in the automotive industry, addressing the evolving landscape of electrification, ADAS, autonomy, and the digital cockpit. Through collaborative initiatives like the Arm Functional Safety Program and Cadence Safety Solution, the partners are spearheading the development of custom silicon solutions and hardware/software co-development for automotive applications. This commitment to innovation ensures that the automotive industry remains at the cutting edge of technology.


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Accelerating 5G System and Subsystem Design with Cadence OrCAD

Designing for Next-Generation 5G/6G Systems

The next generation of 5G/6G systems is set to revolutionize connectivity with unprecedented capacity, coverage, reliability, and ultra-low latency. Cadence OrCAD offers a comprehensive portfolio of tools and IP to tackle the challenges posed by these cutting-edge technologies. From advanced-node SoCs and RFICs to power amplifiers, transceivers, packages, and RF PCBs, Cadence enables designers to meet the stringent requirements of 5G infrastructure. With a focus on high data rates, connected-device count, reliability, security, low latency, and extended battery life, Cadence's solutions are tailored to accelerate the development of 5G communications.

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Cadence OrCAD Customer Support: Accessing Expert Assistance for EDA Challenges

Introduction to Cadence OrCAD Customer Support

Cadence OrCAD offers a range of customer support services to assist users in resolving any Electronic Design Automation (EDA) challenges or technical issues they may encounter. Whether you are utilizing the basic support or premium support options, Cadence is dedicated to providing flexible access to expert assistance for its customers.

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Cadence OrCAD Support and Solution Overview

Cadence Online Support

Cadence recognizes the importance of providing comprehensive support to keep design teams highly productive. The Cadence Online Support portal offers 24x7 access to a wealth of knowledge through articles and technical documentation. Users can easily navigate through the portal to find answers to their queries, troubleshoot issues, and stay updated on the latest product information. Whether you are a seasoned user or new to the platform, Cadence ensures that you have the necessary resources at your fingertips to enhance your design processes and streamline your workflow.

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Cadence OrCAD IC Package Training and Solutions Overview

Cadence IC Package Training Services

Cadence OrCAD offers a comprehensive IC Package Design Training program to cater to the needs of its customers. The training services provided by Cadence Training Services include detailed learning maps that visually outline the learning opportunities available for Cadence customers. These learning maps recommend course flows tailored to specific tool experience and knowledge levels, ensuring a complete learning plan for students. Whether you are a beginner or an experienced professional, Cadence Training Services cover all Cadence Technologies and reference courses globally. With a focus on Cross-Platform Co-Design and Analysis, IC Package Design, SI/PI Analysis Point Tools for IC Packaging, and SI/PI Analysis for IC Packaging, Cadence Training Services deliver in-depth training to enable customers to excel in IC Package design and analysis.

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Cadence OrCAD - AI IP Platform for On-Device AI Acceleration

Revolutionizing AI Processing

Cadence OrCAD's AI IP platform revolutionizes AI processing by offering a comprehensive solution for on-device AI acceleration. The platform empowers SoC developers to design and deliver optimal solutions for a wide range of applications and markets, catering to the increasing demand for energy-efficient on-device to edge AI processing. With IP options including Neo NPUs, Tensilica AI Base, and AI Boost, Cadence OrCAD ensures that SoC developers can meet the power, performance, and area (PPA) demands required by today's AI and machine learning SoCs.

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