Cadence OrCAD Hyperscale Computing Solution Overview

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Cadence OrCAD Hyperscale Computing Solution Overview

Cadence Hyperscale Computing Solutions

Cadence OrCAD offers a comprehensive system design solution tailored for next-generation hyperscale data centers. With years of experience collaborating closely with customers, Cadence provides a suite of technologies to support hyperscale computing's data journey from storage and transmission to data processing requirements. These technologies include low-power solutions, 3D-IC integration, and artificial intelligence/machine learning (AI/ML) capabilities.

Key Benefits of Cadence Hyperscale Computing Solutions

Cadence's hyperscale computing solutions bring a range of benefits to users. These include advanced-node devices, edge, and data center chip design beyond the reticle limit, enabling a shift-left approach to hardware and software integration. The solutions also focus on low power and thermal optimization to extend battery life and maximize energy efficiency. Additionally, users can accelerate design time, decrease development schedules, minimize re-spins, and create 3D-IC derivatives faster. Cadence also offers full system design and analysis, including thermal, electromagnetic, and fluidic analysis for multi-fabric chips, packages, and systems.

Offerings and Capabilities

Cadence's solutions for hyperscale computing enable users to achieve an optimal balance of performance, low power, energy efficiency, and cost. By leveraging Cadence's tools, users can optimize hardware and software, perform system-level thermal analysis, and address thermal effects effectively. The integration of 3D-IC technology allows users to push beyond Moore's Law and implement intricate designs with faster turnaround times. Design complexities are tackled through chip and system optimization for data centers, edge computing, 5G communications, and more.

Data Center Chip Design and System Analysis

Cadence's solutions cater to the evolving demands of data centers, pushing the limits of chip design, hardware/software co-development, board development, and system analysis. To optimize computing workloads, the solutions provide flexibility to include domain-specific accelerators and create multiple derivatives and design options efficiently. These offerings address design complexities that go beyond current reticle limits, where the assembly of chiplets emerges as a viable solution.

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