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Cadence OrCAD: Accelerating Next-Generation Chiplets and SoCs

Cadence Silicon Solutions Portfolio Overview

Cadence OrCAD Silicon Solutions provide a comprehensive set of tools and IP cores to accelerate the deployment of next-generation intelligent systems. With decades of experience in IP and subsystems, Cadence offers silicon-proven Tensilica and Neo AI IP cores, advanced memory interfaces, and high-speed SerDes based on industry-standard protocols. This extensive portfolio allows designers to achieve first-time silicon success by selecting the right IP, subsystem, or silicon solution and fully capturing its value in their designs.

Advantages of Using Cadence Silicon Solutions

By leveraging Cadence OrCAD Silicon Solutions, designers can address IP-to-SoC development in a system context, focusing their efforts on differentiation and utilizing multi-function cores to boost productivity. Choosing Cadence's solutions enables designers to innovate with confidence, offering more design freedom, reduced risk, and quicker time to market. With Cadence's expertise and innovative tools, designers can innovate with unprecedented efficiency and reliability.

Product Families within the Cadence Silicon Solutions Portfolio

The Cadence Silicon Solutions Portfolio includes a range of product families to cater to diverse design requirements. These families encompass Protocol IP for SoCs and chiplets, High-Speed SerDes such as PCIe and Compute Express Link, Denali Memory Interface and Storage IP, Chiplet and D2D Connectivity solutions, Interface IP, Compute IP featuring configurable and extensible Tensilica DSPs, Xtensa controllers, and Neo NPUs, AI IP Platform with offerings like Cadence Janus Network on Chip (NoC) System IP, ConnX DSPs, HiFi DSPs, MathX DSPs, Tensilica Xtensa Controllers, and Vision DSPs, as well as Simulation VIP for various applications.

Applications of Cadence OrCAD Silicon Solutions

Cadence's Silicon Solutions find applications in diverse sectors such as the Hyperscale Data Center industry, Automotive domain with comprehensive IP for ADAS, connected vehicle, digital cockpit, and in-vehicle networking, Consumer Devices & IoT for developing secure, low-power connected devices, AI for scalable accelerator designs and IP cores in AI and machine learning, 5G and Wireless applications, as well as Aerospace & Defense where Cadence's solutions are proven in silicon for a wide range of programs.

Join Cadence for Innovative Silicon Solutions

With a stellar reputation, Cadence has been recognized for its innovative solutions and inclusive culture. As a top company on the FORTUNE 100 list and acknowledged as one of the Best Managed Companies by The Wall Street Journal, Cadence offers a dynamic work environment for professionals looking to make a difference in the world of technology. Join the Cadence team to be part of a culture that fosters creativity, collaboration, and excellence in delivering cutting-edge Silicon Solutions.


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Innovate with Confidence: Cadence OrCAD - Comprehensive Semiconductor Solutions and Services

Cadence Services Overview

Cadence Services provides comprehensive solutions for advanced engineering projects, serving as your global semiconductor partner for expert guidance. With a focus on methodology, technology adoption, silicon enablement, and talent development, Cadence Services offers 20+ years of experience in analog/RF, mixed-signal, custom digital, and complex SoC design. These services cater to diverse industry segments such as wired, wireless, medical, automotive, military/aerospace, and consumer electronics, operating with process geometries down to 6nm and below. Through a turnkey engagement model, Cadence ensures on-time delivery with exceptional quality, having shipped millions of production-worthy silicon worldwide.

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Cadence OrCAD X Platform: Revolutionizing PCB Design Solutions

Unleash Your PCB Design Potential

The Cadence OrCAD X Platform is a cutting-edge PCB design software solution that caters to the ever-changing requirements of modern designs. By leveraging the robust Cadence Allegro X technology, this platform offers an intuitive and efficient user experience. It addresses critical issues encountered by design teams worldwide, focusing on expediting the design process through real-time insights, simplified manufacturing, and live Design Rule Checks (DRCs).

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Cadence OrCAD 3D-IC Design Solutions: Integrated Approach for Advanced Chiplet-Based Designs

Comprehensive 3D-IC Design Solution

Cadence OrCAD offers a comprehensive 3D-IC design solution that covers integration, packaging, custom and digital implementation, verification, system analysis, and interconnect IP for chiplet-based designs. The solution provides a unified cockpit for 3D design planning, implementation, and system analysis, facilitating hardware and software co-verification and full-system power analysis. Moreover, the platform includes chiplet-based PHY IP optimized for latency, bandwidth, and power, ensuring power, performance, and area (PPA) efficiency. It also supports co-design capabilities with custom analog design, board design, IC signoff extraction, static timing analysis (STA) with signal and power integrity (SI/PI), electromagnetic interference (EMI), and thermal analysis.

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Cadence OrCAD Mixed-Signal Solutions: Comprehensive Mixed-Signal Verification and Implementation

Introduction to Cadence OrCAD Mixed-Signal Solutions

Cadence OrCAD offers a robust mixed-signal solution that addresses the challenges of implementation and verification in today's complex design landscape. With a focus on delivering a comprehensive, interoperable, and production-proven methodology, OrCAD streamlines flows to unify a wide spectrum of products and technologies, boosting throughput, productivity, and design efficiency.

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Cadence OrCAD Advanced-Node Solutions for Silicon Proven Design Flows

Increase Silicon Quality

Cadence OrCAD Advanced-Node Solutions offer multi-CPU enabled, advanced, and integrated DPT-aware engines for digital and custom implementation, analysis, and verification. This helps increase silicon quality by providing tools that can handle complex designs and manufacturing challenges, ensuring a higher level of quality and reliability in the final silicon product.

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