Cadence OrCAD 3D-IC Design Solutions: Integrated Approach for Advanced Chiplet-Based Designs

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Cadence OrCAD 3D-IC Design Solutions: Integrated Approach for Advanced Chiplet-Based Designs

Comprehensive 3D-IC Design Solution

Cadence OrCAD offers a comprehensive 3D-IC design solution that covers integration, packaging, custom and digital implementation, verification, system analysis, and interconnect IP for chiplet-based designs. The solution provides a unified cockpit for 3D design planning, implementation, and system analysis, facilitating hardware and software co-verification and full-system power analysis. Moreover, the platform includes chiplet-based PHY IP optimized for latency, bandwidth, and power, ensuring power, performance, and area (PPA) efficiency. It also supports co-design capabilities with custom analog design, board design, IC signoff extraction, static timing analysis (STA) with signal and power integrity (SI/PI), electromagnetic interference (EMI), and thermal analysis.

Key Benefits and Advantages

With over 25 years of experience in advanced packaging, Cadence OrCAD enables customers to achieve higher bandwidth, lower power consumption, and reduced area without traditional process scaling. The solution allows heterogeneous integration of different dies for 2.5D or 3D designs, delivering system-driven power, performance, and area (PPA) optimization. It supports multiple applications in AI, data centers, graphics, and mobile communications ICs with a smaller form factor, maximizing functionality and efficiency.

Offerings for 3D-IC Design

The Cadence OrCAD platform addresses the requirements of 3D-IC design for digital SoCs, analog/mixed-signal designs, and entire systems. It includes multi-chiplet planning, design planning, logic die DFT, signoff and analysis, thermal management, multi-die physical verification, validation, power analysis, and chiplet-based IP. The Integrity 3D-IC Platform, part of the offerings, is a high-capacity, unified design and analysis platform designed for multiple chiplets. Built on Cadence’s leading digital implementation solution, it allows system-level designers to plan, implement, and analyze stacked die systems in various packaging styles.

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