High Productivity for Volume Production
ASML's TWINSCAN XT:860M is a cutting-edge step-and-scan system specifically designed for high-productivity volume production of 300 mm wafers at resolutions of 110 nm and below. By leveraging advanced optics and technology, this system offers exceptional throughput, enabling the processing of 240 300 mm wafers per hour at a low operational cost. The use of highly line-narrowed 40 W KrF lasers with variable frequency control, along with innovative optical transmission capabilities, ensures efficient and cost-effective production.
Optimized Optics for Precision Performance
The TWINSCAN XT:860M features a state-of-the-art optical system that includes a variable 0.80 NA 248 nm 860+ projection lens, delivering exceptional imaging performance with minimal aberrations and distortion. This system provides tight focal planes and precise control over image distortion, guaranteeing high-quality output. Moreover, the system incorporates AERIAL II Illuminator technology, allowing for continuous-variable conventional and off-axis illumination, enhancing imaging accuracy and flexibility.
Superior Imaging Performance and Overlay Control
ASML's TWINSCAN XT:860M excels in imaging performance, achieving remarkable overlay control with a ≤ 12 nm single-machine full-wafer-coverage overlay and a ≤ 14 nm matched-machine full-wafer-coverage overlay. This level of precision is enabled by the system's LithoGuide ILIAS sensor, which facilitates accurate system setup and monitoring of imaging parameters. With its cutting-edge technology and advanced capabilities, the TWINSCAN XT:860M empowers semiconductor manufacturers to achieve unparalleled levels of accuracy and productivity in their production processes.
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