Productivity Boost with Advanced Laser Technology
The TWINSCAN XT:860N step-and-scan system by ASML leverages highly line-narrowed 40, 50, & 60 W KrF lasers with variable frequency control to enhance production throughput. This system can handle 260 300 mm (or 275 200 mm) wafers per hour, ensuring efficient operation at a low cost. By utilizing the UVLS LRL level sensor, productivity can be further increased to 260 wafers per hour, while enabling enhanced alignment mark collection for superior correction models. The AERIAL II Illuminator, coupled with the system's high-speed dual-stage technology, maintains optimal throughput levels across a broad range of resist sensitivities.
Precision Optics for Superior Imaging Performance
The TWINSCAN XT:860N features a variable 0.80 NA 248 nm 860+ projection lens, delivering exceptional imaging quality with minimal aberrations, tight focal planes, and superior distortion control, ensuring annular distortion is kept below 10 nm. This level of optical precision contributes to high-resolution imaging crucial for demanding applications in semiconductor manufacturing.
Leading Imaging Performance and Accuracy
With the TWINSCAN XT:860N, achieving a ≤ 7.5 nm matched-machine full-wafer-coverage overlay is standard. The system's LithoGuide ILIAS sensor enhances setup accuracy and allows users to monitor and fine-tune imaging parameters with precision. This unmatched imaging performance ensures superior quality in the fabrication of advanced semiconductor devices.
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