Increased Productivity and Seamless Integration
The ASML Twinscan XT:400M, a dual-stage i-line dry lithography system, offers a significant boost in productivity for mature-technology markets. One of its key advantages is the seamless integration it provides for chipmakers into their fabs. Unlike its predecessor, the XT:400M does not necessitate additional process changes, making it easy for chipmakers to transition from older machines. This facilitates a quick setup of the XT:400M using existing routines, streamlining the upgrading process for enhanced efficiency.
Optical Column Enhancements for Improved Transmission
The XT:400M boasts hardware upgrades that include enhancements to its optical column, leveraging the latest optical advancements. By improving transmission through the optical column, the system achieves higher productivity levels. These improvements not only contribute to enhanced performance but also translate into superior output for chipmakers utilizing the equipment.
Software Enhancements for Increased Yield
One of the standout features of the XT:400M is its software upgrades aimed at boosting yield. Previous models used the TWINSCAN Overlay Package 2 (TOP-2) to enhance overlay precision from 35 nm to 20 nm, albeit limited to inner fields. With the introduction of TOP-2F in the XT:400M, which extends this capability to the entire wafer, chipmakers can achieve a consistent 20 nm overlay across the entire surface. This enhancement results in a higher number of usable chips per wafer, leading to an overall increase in yield for semiconductor manufacturers.
Stay Ahead in Today’s Competitive Market!
Unlock your company’s full potential with a Virtual Delivery Center (VDC). Gain specialized expertise, drive
seamless operations, and scale effortlessly for long-term success.
Book A Meeting To Setup A VDC