High-Productivity Lithography Tool
The ASML Twinscan XT:1460K stands out as a high-productivity dry ArF lithography tool, offering exceptional overlay and imaging performance for volume production at a resolution of 65 nm. This 193 nm step-and-scan system is specifically designed for volume 300 mm wafer production, equipped with a variable 0.93 NA 193 nm projection lens with advanced lens manipulators. The tool's dual wafer-stage technology allows for the exposure of one wafer while aligning the next in parallel, reducing overhead time and enabling continuous patterning for maximum productivity.
Key Features & Benefits
The Twinscan XT:1460K boasts a standard 45 W ArF laser with variable frequency control, combined with high optical transmission, resulting in a production throughput of 205 wafers per hour on 300 mm wafers. The system's optics leverage a variable 0.65–0.93 NA Carl Zeiss Starlith 4X reduction lens, along with AERIAL-P illuminator technology, pushing the boundaries of ArF technology beyond the 65 nm technology node. Achieving a production resolution as low as 57 nm with polarized illumination, the machine offers excellent CD uniformity, outstanding overlay precision, and long-term stability in performance.
Enhanced Imaging Performance & Precision
With the latest overlay enhancements, the Twinscan XT:1460K can achieve a dedicated chuck overlay of ≤ 3.5 nm and a matched machine overlay of ≤ 5 nm when equipped with the TOP XT:1460K package. The off-line leveling system provides superior focus control across the entire wafer, including edge dies, allowing operation at extremely low-k1 values. This results in superior CD uniformity, industry-leading overlay precision, and stable long-term performance, making it a reliable choice for high-volume production processes.
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