Packaging Reliability Engineer

This role is for an Advanced Packaging Reliability Engineer who will lead the development and execution of reliability test plans and assessments for high-performance computing (HPC) packages. The engineer will optimize package designs using advanced modeling techniques and reliability models, focusing on maximizing the longevity and reliability of semiconductor packages.

Key Responsibilities

• Lead reliability test plans and assessments for HPC packages.
• Optimize package design using thermo-mechanical modeling.
• Develop and apply reliability models and lifetime-prediction methods.
• Evaluate architectures, materials, and assembly processes to maximize reliability.
• Predict electromigration lifetime of interconnects under load.

Required Skills & Qualifications

• 8+ years in semiconductor package reliability and failure analysis.
• Expert in 2.5D/3.5D packaging, interposers, HBMs, redistribution layers.
• Experience in leading package failure investigations with root-cause analysis.
• Strong thermal and mechanical finite-element modeling skills.
• Deep understanding of package materials: CTE, elasticity, creep.
• MS or PhD in Mechanical Eng, Electrical Eng, Materials Science, Physics, or related fields.