Package Assembly Integrator

Job Overview

As a Lead Package Assembly Integrator, you will be responsible for developing end-to-end 3D package assembly, test, and fiber-attach processes with partners. Your role will involve developing and executing package architectures meeting performance and reliability goals, defining test chip requirements, managing design for 3D package development, and validating design rules for high-yield assembly processes.

Responsibilities

• Develop end-to-end 3D package assembly, test, and fiber-attach processes
• Define test chip requirements and manage design for 3D package development
• Develop and validate design rules for high-yield assembly processes
• Plan and execute design of experiments, manage data, and analyze results
• Analyze reliability risks under product use and drive improvements

Requirements & Qualifications

• MS or PhD in Mechanical Engineering, Materials Science, or related field
• 10-12 years of wafer-scale packaging assembly process development
• Knowledge of 2D/3D packaging technologies, materials, and equipment
• Proven ability to define test-chip and assembly-test requirements
• Understanding of photonics packaging, including fiber attach methods